Chemisches Ätzen von Leiterplatten (PCB)
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Strukturierung der elektronischen Leiterbahnen auf Leiterplatten
Übersicht
PCB manufacturing uses chemical etching to create conductive copper traces on fiberglass-reinforced epoxy substrates. The subtractive process involves laminating copper foil onto FR-4 substrate, applying photoresist, exposing through a photomask, developing, etching away unwanted copper, and stripping the resist. This process enables the complex multi-layer circuit boards found in every electronic device from smartphones to satellites. The PCB industry processes billions of square meters of board annually.
Chemischer Prozess
Copper-clad laminate is cleaned and coated with photoresist. UV exposure through a photomask transfers the circuit pattern. The exposed board is developed in Na₂CO₃ to remove unexposed resist, then etched in acidic CuCl₂ or alkaline NH₄OH/CuCl₂ solution to dissolve unprotected copper. Remaining resist is stripped, through-holes are drilled and plated with electroless copper and electroplated copper, and a solder mask is applied.
CuCl + ½Cl₂ → CuCl₂ (etchant regeneration)
Cu²⁺ + 2HCHO + 4OH⁻ → Cu⁰ + 2HCOO⁻ + 2H₂O + H₂ (electroless copper deposition)
Rohstoffe
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FR-4 copper-clad laminate — Laminate manufacturers (fiberglass + epoxy + Cu foil) (Substrate)
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Cupric chloride (CuCl₂) etchant — Chemical synthesis (Copper etchant)
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Photoresist (dry film or liquid) — Specialty chemical manufacturers (Patterning medium)
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Palladium chloride (PdCl₂) — PGM refining (Electroless copper catalyst)
Endprodukte
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Printed circuit boards — All electronic devices — smartphones, computers, automotive, aerospace (1-50+ layer boards, line/space down to 50 microns)
Environmental Impact
PCB manufacturing generates heavy metal wastewater (copper, tin, lead), spent etchants, and photoresist waste. Copper recovery from spent etchant is standard practice. Lead-free soldering (RoHS) has reduced lead pollution but introduced new challenges with tin whisker growth. Brominated flame retardants in FR-4 are an environmental concern.
Sicherheitshinweise
- ⚠ Acidic and alkaline etchants are corrosive
- ⚠ Formaldehyde in electroless copper plating is a carcinogen
- ⚠ Lead in traditional solder (pre-RoHS) is toxic
- ⚠ Drilling and routing generate fiberglass dust — respiratory hazard
Neuere Innovationen
Additive (semi-additive) PCB processes build copper traces up instead of etching away, reducing copper waste.
Laser direct imaging (LDI) eliminates photomasks.
HDI (high-density interconnect) technology with microvias enables smartphone-class miniaturization.
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