Copper Electroplating
Cu2+ + 2e− → Cu
Visão geral
Copper ions from a CuSO₄ solution are reduced at the cathode surface, depositing a thin layer of metallic copper. The anode is typically a copper bar that dissolves to replenish Cu²⁺ in solution. Current density, temperature, and additives control the deposit quality, grain size, and brightness.
Participantes
| Papel | Substância | Coeficiente | Estado |
|---|---|---|---|
| Produto | Copper Cu | 1 | (s) |
Exemplo do cotidiano
The shiny copper plating on decorative items, trophies, and plumbing fixtures is applied by this electrochemical process.
Importância industrial
A cobreagem eletrolítica é essencial no fabrico de PCB, nas interligações de semicondutores e no acabamento decorativo. Cria as camadas condutoras em todos os dispositivos eletrónicos.
Propriedades
- Tipo
- Electrochemical
- Reversível
- Sim
- Energia
- Exotérmico
- ΔH
- -65,5 kJ/mol
Reações relacionadas
Electrorefining of Copper
Alkaline Battery Discharge
Anodizing of Aluminum
Chlor-Alkali Electrolysis
Nickel-Metal Hydride Battery
Daniell Cell (Zinc-Copper Galvanic Cell)
Electrolysis of Molten NaCl (Downs Process)
Lead-Acid Battery Discharge
Hall-Héroult Process (Aluminum Smelting)
Electrolysis of Water
Frequently Asked Questions
What is the equation for Copper Electroplating?
The balanced equation is: Cu²⁺ + 2e⁻ → Cu.
What type of reaction is Copper Electroplating?
Copper Electroplating is a electrochemical reaction. It is reversible under certain conditions.
Is Copper Electroplating exothermic or endothermic?
Copper Electroplating is exothermic (releases energy). The enthalpy change (ΔH) is -65.5 kJ/mol.