Copper Electroplating

概要

Copper ions from a CuSO₄ solution are reduced at the cathode surface, depositing a thin layer of metallic copper. The anode is typically a copper bar that dissolves to replenish Cu²⁺ in solution. Current density, temperature, and additives control the deposit quality, grain size, and brightness.

参加者

日常の例

The shiny copper plating on decorative items, trophies, and plumbing fixtures is applied by this electrochemical process.

産業上の重要性

銅めっきはPCB製造、半導体の配線、そして装飾仕上げに不可欠です。すべての電子機器における導電層を作り出します。