铜电镀
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在金属物体上沉积薄铜层
目标
对金属钥匙或硬币进行铜电镀,演示电沉积工业过程和法拉第定律。
背景
Electroplating uses electrolysis to deposit a thin layer of metal onto a conductive surface. The object to be plated is made the cathode, and the plating metal (copper) is the anode. Copper ions from the solution are reduced and deposited on the cathode surface.
安全警告
- Copper sulfate solution is toxic
- Dilute sulfuric acid is corrosive
- Wear gloves and goggles
- Handle electrical connections with care
所需PPE
材料
-
Copper(II) sulfate (CuSO₄) (200 mL)1M solution
-
Sulfuric acid (H₂SO₄) (10 mL)Dilute, to improve conductivity
-
Copper strip or sheet (1 piece)Anode
-
Metal key or coin (1)Object to plate (cathode)
-
Acetone or alcohol (20 mL)For cleaning the object
设备
步骤
Clean the object (key/coin) by sanding lightly and degreasing with acetone. A clean surface is critical for good plating.
Weigh the clean object on the analytical balance and record the mass.
Prepare the plating solution: 200 mL of 1M CuSO₄ with 5 mL of dilute H₂SO₄.
Suspend the copper strip (anode) and the object (cathode) in the solution, connected to the power supply.
Set the power supply to 3V and turn it on. Observe the copper being deposited on the cathode.
Allow plating to continue for 30 minutes. Periodically check that gas bubbles are minimal (indicates correct voltage).
Turn off the power supply. Remove the plated object, rinse with water, and dry gently.
Weigh the plated object. Calculate the mass of copper deposited and compare with Faraday's law prediction.
预期结果
A smooth, shiny copper coating should cover the object. The mass increase should correlate with Faraday's law: m = (M x I x t) / (n x F), where M is molar mass of Cu, I is current, t is time, n=2, and F is Faraday's constant.
清理
Dispose of copper sulfate solution in heavy metal waste. Rinse all equipment. Clean the copper anode for reuse.
详情
- 难度
- Intermediate (High School)
- 时长
- 60 分钟
- 预估费用
- $15.00
- 步骤数
- 8
- 材料
- 5