Epoxy Resin DGEBA

C₂₁H₂₄O₄

IUPAC: Diglycidyl ether of bisphenol A

CAS: 25068-38-6

Descripción general

DGEBA-based epoxy resins are the most widely used thermosetting polymers, found in adhesives, coatings, and composites. They cure with hardeners to form rigid materials.

Composición

Elemento Símbolo Átomos Masa atómica
Hydrogen H 24 1,0080
Carbon C 21 12,0110
Oxygen O 4 15,9990

Composición elemental

H
7,1%
C
74,1%
O
18,8%

Usos

  • Two-part adhesive
  • Industrial coatings
  • Carbon fiber composite matrix
  • Electronic encapsulation

Datos curiosos

  • The carbon fiber composite in Boeing 787 and Airbus A350 uses epoxy resin as the matrix

Seguridad

  • ⚠ Skin sensitizer
  • ⚠ Irritant

Frequently Asked Questions

What is Epoxy Resin DGEBA?
Epoxy Resin DGEBA (C₂₁H₂₄O₄) is a polymer compound with the IUPAC name Diglycidyl ether of bisphenol A.
What is the molecular weight of Epoxy Resin DGEBA?
Epoxy Resin DGEBA has a molar mass of 340.41 g/mol.
What state is Epoxy Resin DGEBA at room temperature?
Epoxy Resin DGEBA is a liquid at room temperature.
Is Epoxy Resin DGEBA organic or inorganic?
Epoxy Resin DGEBA is classified as an inorganic compound.
What elements make up Epoxy Resin DGEBA?
Epoxy Resin DGEBA (C₂₁H₂₄O₄) is composed of Hydrogen (H), Carbon (C), Oxygen (O).