Resina epoxi DGEBA

C₂₁H₂₄O₄

IUPAC: Diglycidyl ether of bisphenol A

CAS: 25068-38-6

Descripción general

DGEBA-based epoxy resins are the most widely used thermosetting polymers, found in adhesives, coatings, and composites. They cure with hardeners to form rigid materials.

Composición

Elemento Símbolo Átomos Masa atómica
Hidrógeno H 24 1,0080
Carbono C 21 12,0110
Oxígeno O 4 15,9990

Composición elemental

H
Hidrógeno ×24
7,1%
C
Carbono ×21
74,1%
O
Oxígeno ×4
18,8%

Usos

  • • Two-part adhesive
  • • Industrial coatings
  • • Carbon fiber composite matrix
  • • Electronic encapsulation

Datos curiosos

  • ✦ The carbon fiber composite in Boeing 787 and Airbus A350 uses epoxy resin as the matrix

Seguridad

  • ⚠ Skin sensitizer
  • ⚠ Irritant

Propiedades

Tipo
polymer
Estado
liquid
Masa molar
340,41 g/mol
Densidad
1,1600 g/cm³
Solubilidad
insoluble

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Frequently Asked Questions

What is Resina epoxi DGEBA?
Resina epoxi DGEBA (C₂₁H₂₄O₄) is a polymer compound with the IUPAC name Diglycidyl ether of bisphenol A.
What is the molecular weight of Resina epoxi DGEBA?
Resina epoxi DGEBA has a molar mass of 340.41 g/mol.
What state is Resina epoxi DGEBA at room temperature?
Resina epoxi DGEBA is a liquid at room temperature.
Is Resina epoxi DGEBA organic or inorganic?
Resina epoxi DGEBA is classified as an inorganic compound.
What elements make up Resina epoxi DGEBA?
Resina epoxi DGEBA (C₂₁H₂₄O₄) is composed of Hidrógeno (H), Carbono (C), Oxígeno (O).